These products allow a high assembly density, as they do not have to be soldered through the PCB. With their height of less than 8mm they can be mounted on small and compact boards. In order to ensure sufficient resistance force despite the surface mounting, these products have additional lateral plastic anchors and bonding points.
High precision IMU with multi-sensor technology
Robust tactile micro switch for extreme conditions
SoftSIM ready LTE Cat. 1 module
At Texim Europe we constantly invest in people, gather knowledge and expand our worldwide network, so we can select quality components that suit every application in the industry.