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Features

    SIM8270 is a Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module which supports R17 5G NSA/SA.

    With a rich protocols, it is integrated with interfaces such as PCIe, USB3.1, GPIO etc. This module provides applications with great flexibility and ability of integration.

    SIM8270 adopts LGA form factor. AT commands of SIM8270SA are compatible with SIM8260 series modules. This also minimizes costs for customer and shortens time to market.

    It is designed for applications that need huge data transmission in various wireless situations. Due to its high efficiency, security and flexibility, this module suits various applications.


Specifications

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Type of product Cellular 5G R17 module   
Cellular Generation: 5G   
Standard: 5G SA   
Operating temperature -30 to 70 °C   
Power Input voltage: 3.3 to 4.4 V   
Operating temperature -30 to 70 °C   
Dimensions Length: 53 mm   
Width: 46 mm   
Height: 3 mm   







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